“韬”定律之后，何庭波的第二篇论文来了

标题：Huawei's τ Chip Was Supposed to Melt?

翻译：华为的 τ 芯片本会出现过热熔毁？

摘要：Heat is the sharpest concern on τ scaling law — the time-scaling principle behind Huawei’s folded silicon, named for the delay τ (“Tao”) it sets out to shrink. Our Kirin measurements turned that objection upside down. The reason is one every commuter already knows: on a chip, as in a workday, it is the travel that burns the majority of the energy, not the work at the desk.

翻译：热问题是韬（τ）缩放定律最严峻的隐患 —— 这项华为折叠芯片背后的时序缩放原理，得名于其致力于缩短的信号时延 τ（“韬”）。我们对麒麟芯片的实测结果，彻底推翻了这一顾虑。背后的道理通勤族都深有体会：在芯片之中，就如同工作日通勤，**能量大多消耗在路途传输上，而非核心运算本身**。

论文下载链接：网页链接